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1

A 0.66e rms− Temporal-Readout-Noise 3-D-Stacked CMOS Image Sensor With Conditional Correlated Multiple Sampling Technique

Yeh, Shang-Fu, Chou, Kuo-Yu, Tu, Hon-Yih, Chao, Calvin Yi-Ping, Hsueh, Fu-Lung

Journal:

IEEE Journal of Solid-State Circuits

Year:

2018

Language:

english

File:

PDF, 5.30 MB

english, 2018

2

Random Telegraph Noises from the Source Follower, the Photodiode Dark Current, and the Gate-Induced Sense Node Leakage in CMOS Image Sensors

Chao, Calvin Yi-Ping, Yeh, Shang-Fu, Wu, Meng-Hsu, Chou, Kuo-Yu, Tu, Honyih, Lee, Chih-Lin, Yin, Chin, Paillet, Philippe, Goiffon, Vincent

Journal:

Year:

2019

File:

PDF, 12.41 MB

2019

3

Statistical Analysis of the Random Telegraph Noise in a 1.1 μm Pixel, 8.3 MP CMOS Image Sensor Using On-Chip Time Constant Extraction Method

Chao, Calvin, Tu, Honyih, Wu, Thomas, Chou, Kuo-Yu, Yeh, Shang-Fu, Yin, Chin, Lee, Chih-Lin

Journal:

Year:

2017

Language:

english

File:

PDF, 13.26 MB

english, 2017

4

ESD protection under grounded-up bond pads in 0.13 μm eight-level copper metal, fluorinated silicate glass low-k intermetal dielectric CMOS process technology

Kuo-Yu Chou,, Ming-Jer Chen,

Journal:

IEEE Electron Device Letters

Year:

2001

Language:

english

File:

PDF, 315 KB

english, 2001

5

[IEEE ICMTS 2001. Proceedings of the 2001 International Conference on Microelectronic Test Structures - Kobe, Japan (19-22 March 2001)] ICMTS 2001. Proceedings of the 2001 International Conference on Microelectronic Test Structures (Cat. No.01CH37153) - Die cracking evaluation and improvement in ULSI plastic package

Kuo-Yu Chou,, Ming-Jer Chen,, Chiu-Cheng Lin,, Yen-Shien Su,, Chin-Shan Hou,, Tong-Cherng Ong,

Year:

2001

Language:

english

File:

PDF, 737 KB

english, 2001

6

Extraction and Estimation of Pinned Photodiode Capacitance in CMOS Image Sensors

Chao, Calvin Yi-Ping, Chen, Yi-Che, Chou, Kuo-Yu, Sze, Jhy-Jyi, Hsueh, Fu-Lung, Wuu, Shou-Gwo

Journal:

IEEE Journal of the Electron Devices Society

Year:

2014

Language:

english

File:

PDF, 1.54 MB

english, 2014

7

Reliability of VLSI-level chip assembly for evaluating the development of back-end technologies using a test chip with a top two-level metal structure

Kuo-Yu Chou,, Ming-Jer Chen,, Chi-Wen Liu,, Bing-Hong Lin,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2002

Language:

english

File:

PDF, 1.01 MB

english, 2002

8

Active devices under CMOS I/O pads

Kuo-Yu Chou, Ming-Jer Chen, Chi-Wen Liu

Journal:

IEEE Transactions on Electron Devices

Year:

2002

Language:

english

File:

PDF, 1.17 MB

english, 2002

9

[IEEE 2015 Symposium on VLSI Circuits - Kyoto, Japan (2015.6.17-2015.6.19)] 2015 Symposium on VLSI Circuits (VLSI Circuits) - A 0.66e−rms temporal-readout-noise 3D-stacked CMOS image sensor with conditional correlated multiple sampling (CCMS) technique

Yeh, Shang-Fu, Chou, Kuo-Yu, Tu, Hon-Yih, Chao, Calvin Yi-Ping, Hsueh, Fu-Lung

Year:

2015

Language:

english

File:

PDF, 617 KB

english, 2015

10

Two ID-based authenticated schemes with key agreement for mobile environments

Chih-Ho Chou, Kuo-Yu Tsai, Chung-Fu Lu

Journal:

The Journal of Supercomputing

Year:

2013

Language:

english

File:

PDF, 555 KB

english, 2013

11

Active circuits under wire bonding I/O pads in 0.13 μm eight-level Cu metal, FSG low-k inter-metal dielectric CMOS technology

Kuo-Yu Chou,, Ming-Jer Chen,

Journal:

IEEE Electron Device Letters

Year:

2001

Language:

english

File:

PDF, 95 KB

english, 2001

12

CMOS Image Sensor Random Telegraph Noise Time Constant Extraction From Correlated To Uncorrelated Double Sampling

Chao, Calvin Yi-Ping, Tu, Honyih, Wu, Thomas, Chou, Kuo-Yu, Yeh, Shang-Fu, Hsueh, Fu-Lung

Journal:

IEEE Journal of the Electron Devices Society

Year:

2017

Language:

english

File:

PDF, 1.98 MB

english, 2017

13

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Analysis and design of MEMS RF probe

Hou-Jun Hsu,, Jung-Tang Huang,, Kuo-Yu Lee,, Ting-Chiang Tsai,, Chia-Hung Chou,

Year:

2012

Language:

english

File:

PDF, 3.08 MB

english, 2012

14

[IEEE 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) - Dresden (2010.03.8-2010.03.12)] 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) - A robust ADC code hit counting technique

Jiun-Lang Huang,, Kuo-Yu Chou,, Ming-Huan Lu,, Xuan-Lun Huang,

Year:

2010

Language:

english

File:

PDF, 276 KB

english, 2010

15

[ASME ASME 2016 Conference on Information Storage and Processing Systems - Santa Clara, California, USA (Monday 20 June 2016)] ASME 2016 Conference on Information Storage and Processing Systems - Modeling and Analysis of Touch on the Flexible Ultra-Thin Touch Panel by Using the Finite Element Method

Chao, Paul C.-P., Chou, Kuo-Yu, Wu, Chang-Xian, Chen, Chuan-Xin, Lu, Yi-Chuan, Li, Chien-Ju, Chen, Heng-Yin

Year:

2016

Language:

english

File:

PDF, 1.38 MB

english, 2016

16

Efficient and secure three-party authenticated key exchange protocol for mobile environments

Chou, Chih-ho, Tsai, Kuo-yu, Wu, Tzong-chen, Yeh, Kuo-hui

Journal:

Journal of Zhejiang University SCIENCE C

Year:

2013

Language:

english

File:

PDF, 548 KB

english, 2013

17

Low band gap-conjugated polymer derivatives

Chun-Guey Wu, Chnug-Wei Hsieh, Ding-Chou Chen, Shinn-Jen Chang, Kuo-Yu Chen

Journal:

Synthetic Metals

Year:

2005

Language:

english

File:

PDF, 305 KB

english, 2005

18

Determination of optical parameters of a twisted-nematic liquid crystal by phase-sensitive optical heterodyne interferometric ellipsometry

Tsai, Chien-Chung, Chou, Chien, Han, Chien-Yuan, Hsieh, Cheng-Hung, Liao, Kuo-Yu, Chao, Yu-Faye

Journal:

Year:

2005

Language:

english

File:

PDF, 505 KB

english, 2005

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